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ams OSRAM

Senior Engineer, RD Packaging & Module Engineering

ams OSRAM
Wuxi, CN, 214000Full TimeSeniorPosted Today


 

Sense the power of light

The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends. Find out more about us on https://ams-osram.com

 

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Your new responsibilities

-Support New Product Introductions by delivering assigned Process and Equipment solutions meeting or exceeding Quality and timeline targets.
-Contribute during project kick-off, product process review, design/drawing review, technical risk assessment, DOE, design FMEA, equipment specification preparation, equipment ordering, process/ equipment setup, process/ equipment run, handover documentation to production line, etc.
-Ensure equipment 2nd source and cost savings targets be met through new supplier or new process introduction.
-Contribute to effective resolution of chronic issues through innovative or out-of-box solutions.
-Able to saw machine independently.
-Ensure self-development to continually upgrade overall performance.


What we look for


-Bachelor's Degree in Electrical/Electronics/Mechanical Engineering or equivalent.
->5years in Semiconductor field and Sawing process. Familiar with Disco, Hanmi, TSK (AccreTech) machine or other sawing machine model.
-Sawing equipment or process experience related. Familiar with LED/Semiconductor assembly process.
-Can fluently use different version of office software. JMP or Minitab is required, Familiar with DFMEA, DFSS, QFD and Six Sigma preferred.
-Proficiency in English. CET-4 Minimum, CET-6 preferred.
-Able to work with stress and adapt to fast changes.


Please contact LuPing Zhu for further information via LUPING.ZHU@AMS-OSRAM.COM or +86 (510) 8190 8315.

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Senior Engineer, RD Packaging & Module Engineering at ams OSRAM